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Compact Diffusion-bonded Heat Exchangers
 
Less is more¡­
    Heatric compact, diffusion-bonded heat exchangers are highly temperature, highly pressure and highly robust. Heatric exchangers offer big process benefits that you will not get from conventional exchangers, and maximize your benefits¡­¡­
 
  Total Solution
¡¤High Temp., High Pressure Up to 900¡ãC, 650bar
¡¤Compact Up to 85% smaller and lighter than the equivalent shell and tube exchanger
¡¤Multi-Stream Be capable of containing more than two process streams in a single unit
¡¤Main Specification  
¡¤Reference List  
The Printed Circuit Heat Exchanger (PCHE)
First introduced by Heatric in 1985, is an established compact heat exchanger technology.
Through innovative design and a unique manufacturing process, Heatric produces high integrity heat transfer solutions,
in close partnership with clients.
Plate-fin style construction
Corrugated fin sandwiched between plain plates£¬Higher integrity than brazed aluminum plate-fin£¬Pressures capability to 200 bar, temperature capability same as PCHE£¬Channel cross section up to 4 mm x 4mm.
Create value for clients
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